Evatec Thin Film Deposition Equipment

Evatec is a thin film equipment manufacturer from Trübbach, Switzerland, with origins in Balzers AG in 1946: CLUSTERLINE cluster tools, BAK evaporators, LLS EVO II, HEXAGON and SOLARIS sputter tools.

CLUSTERLINE 200 cluster tools

A modular cluster platform for 4 to 8 inch wafers that combines etch, PVD, PECVD and PEALD without breaking vacuum between steps. The VTM8 transfer module takes up to 6 process modules, the BPM batch module runs 15 wafers of 8 inches per batch, and chucks cover –30 to 1000 °C.

Wafers 4-8 inches
Up to 6 process modules
BPM batch: 15 wafers of 8 in
Chuck: –30 to 1000 °C

CLUSTERLINE 300 cluster tools

A platform for 8 to 12 inch wafers that combines PVD, PVE soft etch, degas and cooling in one vacuum environment. The transfer module takes up to 6 process modules and the front end up to 3 FOUP load ports. Chucks cool to –30 °C and heat to 750 °C; thin wafers from 100 µm are handled.

Wafers 8-12 inches
Up to 6 process modules
Chuck heating to 750 °C
Thin wafers from 100 µm

CLUSTERLINE 600 panel tools

A cluster tool for panels up to 650 × 650 mm with degas, etch and sputter deposition for FOPLP and advanced IC substrates. The transfer module takes up to 5 process modules; etch uses the PSS600 capacitive plasma source and PVD the SSS600 with 4 rotatable cathodes. Introduced in 2017.

Panels up to 650 × 650 mm
Up to 5 process modules
SSS600: 4 rotatable cathodes
Introduced in 2017

BAK 501-1401 evaporators

Evaporators with thermal sources, effusion cells and e-guns in platform sizes from 0.5 to 1.4 m, from the BAK 501 for university R&D to the BAK 1401 that loads 28 substrates of 8 inches per batch. Split Chamber and lift-off versions are available. Over 2000 BAKs delivered.

Platform sizes 0.5-1.4 m
BAK 1401: 28 substrates of 8 in
Optical monitoring to 1700 nm
Over 2000 BAKs delivered

Multi BAK and BAK911 clustered evaporators

Introduced in 2022, the Multi BAK clusters up to 4 BAK process chambers around an atmospheric robot with fully automated handling. The BAK911 is a single-chamber version with load lock transfer. Both are built for 6 and 8 inch wafers and cut energy use by up to 60 %.

Up to 4 BAK chambers
Wafers 6 and 8 inches
Energy use down by up to 60 %
Introduced in 2022

HEXAGON wafer level packaging tools

A tool for UBM, RDL and fan-out wafer level packaging on 200 and 300 mm wafers, with a synchronous indexer, an atmospheric batch degasser for 28 or 44 wafers and up to 5 process ports. Contact resistance below 2.0 mOhm, etch uniformity under 2 %, kit life above 20,000 wafers.

Wafers 200 and 300 mm
Rc below 2.0 mOhm
Kit life over 20,000 wafers
Over 80 wafers per hour

LLS EVO II vertical sputter tools

A vertical dynamic batch sputter tool with separate load and process chambers: up to 5 DC, RF or DC/RF cathodes plus an etch source. Substrates from 2 to 8 inches and up to 200 × 230 mm, size changeover within 5 minutes, co-sputtering from 3 sources. Over 300 tools are installed worldwide.

Up to 5 sputter cathodes
Substrates up to 200 × 230 mm
Size change within 5 minutes
Over 300 tools installed

SOLARIS S151 and S380 inline sputter tools

Inline sputter tools with a synchronous carrier indexer for fully automated fabs: the S151 has up to 6 process stations for substrates up to 8 inch diagonal, the S380 up to 5 stations for up to 15 inch. PVD, etch and RTP heating to 400 °C; target and shield change takes 30 or 60 minutes.

S151: up to 6 stations
S380: up to 15 inch diagonal
RTP heating to 400 °C
Target change in 30 min

Selecting Evatec tools by process and substrate

A tool is chosen by process and substrate size.

CLUSTERLINE 200 covers 4 to 8 inch wafers and combines etch, PVD, PECVD and PEALD without breaking vacuum, CLUSTERLINE 300 covers 8 to 12 inch wafers, CLUSTERLINE 600 handles panels up to 650 × 650 mm, and HEXAGON runs UBM, RDL and FOWLP on 200 and 300 mm wafers.

For evaporation of metals and dielectrics there are BAK evaporators with platforms from 0.5 to 1.4 m and the clustered Multi BAK for 6 and 8 inch wafers; LLS EVO II serves vertical batch metallization and magnetic films, and the SOLARIS S151 and S380 inline tools serve high speed sputtering in automated fabs.

Company and service organization

Evatec AG is based in Trübbach, Switzerland, with origins in the Balzers AG corporation in 1946. Its core technologies are etch, evaporation, sputter, PECVD and PEALD; the company holds more than 200 patents and runs the ECL laboratory with more than 30 deposition tools.

The manufacturer has over 100 field service and field application engineers, and its warehouses hold about 5000 different spare parts.

Evatec and model names are trademarks of their respective owners and are used only to identify the equipment for which we source parts. SpareX is not an official dealer, distributor or representative of Evatec and is not affiliated with the trademark owner. Origin, documents and warranty are stated for each item in the quotation.