RENA Technologies Wet Processing Equipment

RENA Technologies is a wet processing equipment manufacturer from Gütenbach, Germany, founded in 1993: immersion, single-wafer and spray tools, electroplating, dryers and solar cell lines.

Convergence, Evolution and Revolution+ immersion benches

Benches for etching, cleaning and resist stripping in FEOL and BEOL. Convergence is automatic, for 150, 200 and 300 mm wafers, with or without carriers. Evolution is a linear automatic bench for 100-200 mm wafers in lots of 25, 50 and 100. Revolution+ is compact, with a rotary robot.

Wafers up to 300 mm
Lots of 25, 50 and 100 wafers
Rotary robot on Revolution+
Integrated Genesis dryer

Inception, Vanguard and ACE single-wafer tools

Inception is a semi-automatic tool for R&D and pilot production: wafers up to 200 mm, masks up to 7 × 7 inches, 2-4 chemical tanks and etch uniformity of 1 % or better. Vanguard is a fully automatic tool for 300 mm wafers with 4-8 chambers. ACE performs wet chemical etching of SiC.

Wafers up to 300 mm
Etch uniformity ≤ 1 %
4 to 8 chambers on Vanguard
Wet etching of SiC

SAT and SST spray tools, Genesis dryers

SAT spray acid tools and SST spray solvent tools etch, clean and strip resist from 50-200 mm wafers in 25-wafer loads. Up to five processes can be combined in one chamber, and a single chamber runs 75-100 wafers per hour. The Genesis Marangoni dryer uses less than 20 ml of IPA per cycle.

Wafers 50-200 mm
Up to 5 processes per chamber
Single chamber: 75-100 wph
Dryer: IPA < 20 ml per cycle

EPM 2 and EPA electroplating systems

EPM 2 is a manual fountain plating tool for R&D and small-scale production, handling 2-8 inch wafers. EPA is an automatic platform with wafer handling and wafer rotation during the process. They plate Au, Ag, Cu, Sn, Ni and SnAg with edge exclusion of 3 mm or less, for bumping and TSVs.

Wafers 2-8 inches
Edge exclusion ≤ 3 mm
Fountain chamber on EPM 2
Metals: Au, Cu, Ni, SnAg

LWC, PPC and FC bare wafer processing systems

Automatic benches for etching and cleaning bare 200 and 300 mm wafers: after lapping, after CMP, before epitaxy and at final cleaning. Materials include mono-Si, Ge, GaAs and GaN. The Final Cleaning System removes particles and metals and finishes with an integrated Marangoni dryer.

Wafers 200 and 300 mm
Post-CMP cleaning
Integrated Marangoni dryer
Wafer reclaim

BatchTex N and BatchEtch N batch systems

BatchTex N performs saw damage removal and alkaline texturing of mono-Si, while BatchEtch N runs alkaline or acidic etching and boron emitter removal. Throughput reaches 15,000 wafers per hour, with N600, N400 and N50 versions named by wafers per bath and thin wafers down to 100 µm.

Up to 15,000 wafers per hour
Up to 600 wafers per bath
Thin wafers from 100 µm
MES interface SECS/GEM

InEtchSide 4+ and InOxSide 3 inline systems

InEtchSide 4+ on the NIAK 4+ platform removes SiO2 and doped PSG and BSG glass from one side of the wafer on 12-14 lanes, for IBC and TOPCon cells. InOxSide 3 performs edge isolation, rear side polishing and doped glass removal on 5-6 lanes at up to 6,000 wafers per hour.

12 to 14 lanes
Up to 6,000 wafers per hour
Rear side etching 1-5 µm
Wafer formats M0-M12

BatchFinalClean wafer cleaning and monoTEX additive

BatchDeGlue removes adhesive and pre-cleans bricks after sawing, and BatchFinalClean performs final cleaning of wafers up to G13 before texturing, with ultrasonic cleaning. The monoTEX additive for IPA-free alkaline texturing forms pyramids of 2-5 µm.

Wafers up to G13 format
Pyramids 2-5 µm
IPA-free texturing
Reflectance below 12.5 %

Selecting RENA wet benches by process and wafer size

A tool is chosen by process, material and wafer size.

Batch processing of 150, 200 and 300 mm wafers runs on the Convergence, Evolution and Revolution+ immersion benches; critical etching and the step from R&D to pilot production run on the single-wafer Inception (up to 200 mm), 300 mm wafers on Vanguard, and SiC etching on ACE.

For spray processing with acids and solvents there are SAT and SST, for drying COMPASS SRD, Genesis Marangoni and VaporDry (85 % less IPA than boiling sump vapor dryers), and for plating EPM 2 and EPA. The tools process Si, SiC, GaN, GaAs and InP.

Solar lines and the company

For solar cells RENA builds the BatchTex N and BatchEtch N batch systems (up to 15,000 wafers per hour), the InEtchSide 4+ and InOxSide 3 inline systems, BatchDeGlue and BatchFinalClean wafer cleaning and the monoTEX additive for IPA-free texturing.

RENA Technologies GmbH was founded in 1993 and is headquartered in Gütenbach in the Black Forest, Germany, with about 560 employees; besides semiconductors and solar, it builds equipment for glass and medical devices.

RENA Technologies and model names are trademarks of their respective owners and are used only to identify the equipment for which we source parts. SpareX is not an official dealer, distributor or representative of RENA Technologies and is not affiliated with the trademark owner. Origin, documents and warranty are stated for each item in the quotation.