Rapid thermal processing systems and components Annealsys
Engineering selection and parts support for Annealsys vacuum platforms: AS-One and AS-Micro furnaces, Zenith systems, DLI-CVD tools and controllers.
Compact Rapid Thermal Processing systems Annealsys AS-Micro series
Annealsys AS-Micro desktop rapid thermal processing furnaces feature quartz tube reaction chambers engineered for substrates up to 76 mm diameter. Tubular infrared halogen lamp arrays achieve process temperatures up to 1250 C with heating ramp rates exceeding 250 C per second.
- Quartz tube reaction chamber with stainless steel vacuum sealing flange body
- Water-cooled tubular reflector housing with linear infrared halogen heating lamps
- Digital PID temperature controller with thermocouple input and optional pyrometer
- Multi-channel process gas manifold with calibrated thermal mass flow controllers
Versatile Rapid Thermal Annealing furnaces Annealsys AS-One 100 and 150
Annealsys AS-One cold-wall rapid thermal processing systems process wafers up to 100 mm and 150 mm diameter. The platform performs rapid thermal annealing, rapid oxidation, nitridation and rapid chemical vapor deposition RTCVD for graphene and two-dimensional materials synthesis.
- Cold-wall stainless steel process chamber with water cooling and quartz window
- Dual-zone halogen lamp heating bank with independent multizone power regulation
- Broad operating vacuum range from atmospheric pressure down to 1e-6 Torr level
- Silicon carbide coated graphite susceptor plates ensuring uniform thermal flux
Industrial Rapid Thermal Processing platforms Annealsys AS-Master 200
Annealsys AS-Master 200 automated rapid thermal processing platforms are engineered for pilot manufacturing and high-throughput production of 200 mm wafers. The system integrates automated load lock transfer robotics to ensure continuous contamination-free production workflows.
- Automated multi-wafer loadlock vacuum transfer module with robotic substrate arm
- Multi-zone infrared lamp matrix with dynamic radial temperature field tuning
- Non-contact optical pyrometer measuring wafer backside temperature accurately
- Direct integration with dry turbomolecular pump stations and vacuum valves
Ultra-high temperature Rapid Thermal furnaces Annealsys Zenith series
Annealsys Zenith ultra-high temperature rapid thermal furnaces process silicon carbide SiC and gallium nitride GaN substrates at temperatures up to 2000 C for extended duration. The system delivers rapid ramp rates under pure argon atmosphere or controlled vacuum conditions.
- High temperature thermal core designed for sustained operation reaching 2000 C
- Multi-layer graphite radiation heat shields surrounded by a water-cooled body
- Specialized silicon carbide susceptor assemblies for post-implantation annealing
- Precision optical ratio pyrometer calibrated against high temperature standards
Multi-process deposition reactors Annealsys MC-050 and MC-100
Annealsys MC-050 and MC-100 direct liquid injection reactors combine DLI-CVD and DLI-ALD capabilities within a single process chamber. The tools synthesize complex multi-metallic oxides, transition metal nitrides and functional thin films from thermally sensitive liquid reagents.
- High-frequency DLI pulse injectors dosing unstable liquid chemical precursors
- Flash vaporization unit with minimal internal dead volume for sharp transitions
- Vertical warm-wall reaction chamber geometry preventing precursor condensation
- Compatibility with organometallic compounds and air-sensitive precursor fluids
Rapid Thermal Annealing systems Jipelec JetFirst and JetLight by Annealsys
Proven Jipelec JetFirst and JetLight rapid thermal annealing platforms are built and supported by Annealsys following established engineering standards. The systems support semiconductor wafers up to 300 mm diameter across advanced university and microelectronic fab laboratories.
- Water-cooled rectangular aluminum chamber body with pure quartz isolation plate
- Cross-lamp halogen infrared matrix delivering uniform flux over 300 mm platens
- Upgraded digital temperature control unit with intuitive modern software suite
- Complete stock of replacement fluoroelastomer seals, quartz trays and IR lamps
Temperature Sensor Calibration and Optical Pyrometer Setup for Annealsys Tools
Precise thermal control in Annealsys rapid thermal processing equipment requires periodic alignment of temperature measurement loops. In lower temperature regimes up to 800 C, the platform uses type K thermocouples or tungsten-rhenium junctions contacting graphite susceptors or wafer backsides.
For high temperature processing above 800 C, the digital system automatically switches feedback to the optical pyrometer. Field specialists calibrate the optical sensor using standard silicon melting transitions, compensating for dynamic emissivity shifts caused by growing dielectric films.
Dual-sensor regulation prevents temperature overshoot and guarantees reproducible wafer profiles across all thermal cycles.
Maintenance of High-Purity Quartz Tubes and Flange Vacuum Seals on AS-Micro
In Annealsys AS-Micro desktop furnaces, thermal annealing reactions occur inside reaction tubes made of high-purity optical quartz. Preventive maintenance routines require rigorous visual examination of quartz tube walls to detect microfractures, edge chips and chemical etching marks.
Technicians install high-vacuum fluoroelastomer O-ring kits prepared with ultra-low outgassing vacuum grease whenever opening flange joints.
Before mounting a replacement quartz tube, the component undergoes ultrasonic cleaning in deionized water followed by high-vacuum thermal degassing at 600 C, ensuring base chamber pressures reach 1e-2 Torr without background contamination.
Thermal Field Uniformity Mapping and Pulse Annealing on AS-One Platforms
Annealsys AS-One multi-purpose platforms employ dual-surface infrared lamp heating with multi-zone dynamic power tuning. Engineering teams perform substrate temperature mapping using high-density thermocouple sensor arrays across wafer diameters.
Fine adjustments of zone PID loop coefficients eliminate perimeter radiation heat losses and minimize radial temperature gradients across substrates below one percent.
During pulse annealing recipes, operators program rapid lamp pulse bursts down to tens of milliseconds, activating implanted dopant profiles in thin surface regions while preventing thermal diffusion into the bulk semiconductor crystal.
Cleaning Protocols for DLI Liquid Injectors and Precursor Vaporizers on MC-100
Annealsys MC-100 and MC-050 thin film deposition systems utilize direct liquid injection DLI assemblies featuring high-frequency electromagnetic pulse injectors.
To prevent nozzle clogging from thermally sensitive organometallic compounds, automated purging sequences flush fluid conduits with ultra-dry solvent after recipe completion. The ultrasonic dispersion vaporization chamber undergoes regular ultrasonic bath cleaning with microscopic nozzle inspection.
Replacing PTFE seals and tuning injector drive pulse widths eliminates vapor concentration fluctuations in the deposition zone, ensuring uniform thin film thickness.
Operational Regimes for High-Temperature Graphite Heating Elements on Zenith
Annealsys Zenith ultra-high temperature platforms operate at temperatures up to 2000 C during thermal annealing of silicon carbide SiC and gallium nitride GaN crystals.
The thermal core incorporates multi-layer high-density graphite radiation shields protected by an external water-cooled stainless steel vessel.
Preventive maintenance schedules specify resistance checks of graphite heating elements and dielectric verification of ceramic isolators after extended heating cycles.
High-purity dry argon atmospheres protect graphite components against oxidation, while dense SiC susceptors prevent carbon vapor cross-contamination.
Digital Controller Upgrades and Vacuum Manifold Modernization on Jipelec Tools
Legacy Jipelec JetFirst and JetLight rapid thermal annealing platforms are systematically upgraded with modern Annealsys digital electronics.
Retrofit programs replace obsolete micro-controller boards with high-speed industrial controllers featuring Ethernet networking and intuitive graphical recipe software.
Technicians modernize vacuum manifolds by installing rapid pneumatic angle valves, ceramic bearing turbomolecular pumping units and wide-range Pirani vacuum gauges.
This comprehensive retrofit extends production tool longevity, ensures precise process data logging and guarantees cleanroom standard compliance.
Annealsys and model names are trademarks of their respective owners and are used only to identify the equipment for which we source parts. SpareX is not an official dealer, distributor or representative of Annealsys and is not affiliated with the trademark owner. Origin, documents and warranty are stated for each item in the quotation.
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Documents and sources
- Official Annealsys portal — rapid thermal processing and chemical vapor deposition systems
- Annealsys corporate headquarters — Montpellier manufacturing facility and service department
- Rapid thermal processing equipment — engineering specifications of AS-One and AS-Micro systems
- DLI-CVD thin film deposition tools — direct liquid injection reactors of MC product series
- Annealsys technical service center — maintenance program and legacy equipment retrofit kits
