Semiconductor Manufacturing Equipment Shibaura Mechatronics

Shibaura Mechatronics Corporation single-wafer cleaning systems SC300-CC, hot phosphoric acid etching SC300-HT, chemical dry etching CDE, and die bonders TFC-6500/6800. Cleanroom semiconductor manufacturing equipment selection.

Post-CMP Single-Wafer Cleaning Systems SC300-CC Series

Single-wafer SC300-CC systems achieve industry-leading particulate removal down to 19 nm following polishing operations. Wet transfer mechanics prevent secondary contamination across critical wafer areas. Optimized chamber architecture increases overall cleaning performance on 300 mm wafer lines.

Single-wafer 300 mm post-CMP cleaning platforms including SC300-CC series
Removal of fine slurry particles down to 19 nm following polishing stages
Wet wafer transfer integration preventing cross-contamination from foreign matter
Double-sided rotating brush units, chemical dispensing nozzles, robotic end-effectors

Final and Inter-Process Single-Wafer Cleaning Systems SC300-FC Series

Single-wafer SC300-FC systems provide precision surface preparation prior to critical lithography and packaging steps. Dedicated fluid dynamics clean the front face, back side, and wafer bevel profile. Controlled chemical dispensing preserves sensitive nanoscale patterns from hydrodynamic stress.

Final single-wafer cleaning equipment platforms including SC300-FC series
Full-coverage front, backside, and bevel edge cleaning on 300 mm substrates
Controlled megasonic fluid delivery preserving delicate device topography
Wafer edge centering sensors, diaphragm chemical pumps, PTFE pneumatic valves

Hot Phosphoric Acid Single-Wafer Wet Etching Systems SC300-HT Series

Single-wafer SC300-HT tools deliver selective silicon nitride wet etching using hot phosphoric acid at 160°C and above. A zone-controlled proximity heater ensures uniform etch depth across the substrate. The integrated 2-in-1 layout combines chemical etching with thorough post-cleaning.

Hot phosphoric acid single-wafer wet etching systems including SC300-HT series
High-selectivity silicon nitride etching at chemical temperatures above 160°C
Multi-zone wafer proximity heating minimizing groundwork oxide film loss
Quartz immersion heating elements, high-temperature thermocouples, FFKM seals

Chemical Dry Etching and Surface Treatment Systems CDE Series

CDE series tools perform isotropic chemical dry etching utilizing remote neutral radicals without physical ion bombardment. Generating plasma outside the process chamber protects sensitive gate oxides from electrical stress. The process rounds trench profiles and removes RIE surface damage.

Isotropic chemical dry etching platforms including CDE series equipment
Trench opening profile rounding and post-RIE surface damage layer removal
Remote microwave plasma source delivering radical-only damage-free etching
Microwave generators, mass flow controllers MFC, high-vacuum gate valves

High-Accuracy Multi-Process Die Bonders TFC-6500 Series

High-accuracy TFC-6500 bonders mount semiconductor dice in Clean Class 100 manufacturing environments. Advanced vision alignment delivers face-down precision within ±1 um and face-up within ±3 um. Thermal compression heads assemble advanced packaging architectures including 2.5D, 3D, and UHD FO-WLP.

Multi-process advanced packaging bonders including TFC-6500 series
Die placement for 2.5D, 3D, UHD FO-WLP, and silicon photonics assemblies
Alignment accuracy of ±1 um face-down with speeds exceeding 2100 UPH
Thermal compression bonding heads, vacuum collets, closed-loop servo stages

Ultra-Precision Direct Cu-Cu Hybrid Bonders TFC-6800 Series

TFC-6700 and TFC-6800 tools deliver direct bumpless copper-to-copper diffusion bonding in Clean Class 1 cleanrooms. An anti-vibration structural base delivers sub-micron placement alignment. The dual-head architecture of TFC-6800 provides superior throughput for high-bandwidth memory packaging.

Ultra-high-accuracy direct hybrid bonding systems including TFC-6800 series
Bumpless copper-to-copper interconnection for HBM memory and AI processors
Rigid anti-vibration structural layout achieving Clean Class 1 compliance
Dual bonding heads, vacuum plasma surface activators, piezo motion stages

Configuring SC300-CC Post-CMP Wafer Cleaning Systems on 300 mm Lines

Single-wafer SC300-CC systems deliver leading post-CMP particulate removal down to 19 nm following polishing operations. Wet transfer mechanics prevent secondary contamination across critical wafer areas. Optimized chamber architecture increases overall cleaning performance on 300 mm wafer lines.

Direct hardware coupling with CMP polishers streamlines wafer transit while automated megasonic and brush scrubbers eliminate trace slurry residues without microscratching polished wafer faces.

Final and Inter-Process Wafer Preparation Using SC300-FC Platforms

Dual-sided rotating brush assemblies and megasonic rinse nozzles guarantee defect-free substrates across full 300 mm diameters, supporting rigorous quality thresholds on advanced production nodes.

Selective Nitride Removal with SC300-HT Hot Phosphoric Acid Systems

Real-time silicon concentration regulation within recirculating phosphoric acid maintains etch selectivity over underlying oxide barriers while eliminating pattern collapse during drying.

Isotropic Plasma Damage-Free Chemical Dry Etching with CDE Systems

Long-distance radical transfer deactivates energetic plasma ions before reaching the wafer surface, delivering defect-free smoothing for deep trenches and high-aspect-ratio microstructures.

High-Precision Advanced Packaging Assembly on TFC-6500 Die Bonders

Accommodating wide die geometries and operating at speeds above 2100 UPH, the platform bridges R&D prototyping and high-volume packaging for artificial intelligence processors and optoelectronics.

Direct Cu-Cu Bumpless Interconnection Using TFC-6800 Hybrid Bonders

Coupled with the HSM-1000 surface activation and wet cleaning module, the platform forms an integrated one-stop manufacturing cell for fine-pitch chiplet stacking and high-bandwidth memory.

Shibaura Mechatronics and model names are trademarks of their respective owners and are used only to identify the equipment for which we source parts. SpareX is not an official dealer, distributor or representative of Shibaura Mechatronics and is not affiliated with the trademark owner. Origin, documents and warranty are stated for each item in the quotation.