Automated Inspection and Test Systems Test Research Inc / TRI

Test Research, Inc. (TRI) high-speed 3D SPI TR7007, 3D AOI TR7700, conformal coating inspection TR7700 CI, 3D CT AXI TR7600, and ICT TR5001 systems. Electronics assembly line equipment selection.

High-Speed 3D Solder Paste Inspection Systems TR7007 Series

TR7007Q SII and TR7007 SIII 3D SPI platforms deliver precision solder paste volume, area, and height metrology at speeds up to 200 cm2/sec. The EtherCAT motion architecture and 4-way digital fringe projectors eliminate shadow effects across densely packed circuit boards.

Flagship 3D SPI platforms including TR7007Q SII, TR7007D SII, and TR7007 SIII
Lead-free solder paste printing inspection on fine-pitch SMT assembly lines
EtherCAT motion controller, 200 cm2/sec speed, SmartWarp PCB compensation
Telecentric lenses, DLP pattern projectors, servo motors, conveyor belts

High-Accuracy 3D Automated Optical Inspection Systems TR7700 Series

TR7700Q SII and TR7500QE Plus 3D AOI systems deliver high-speed optical inspection of assembled surface mount boards up to 57 cm2/sec. The 21 MP Stop-and-Go camera and multi-phase True Color LED lighting capture micro-components down to 0201 with exceptional contrast and zero escapes.

3D AOI platforms including TR7700Q SII, TR7700 SIII Ultra, and TR7500QE Plus
SMT assembly inspection for BGA coplanarity, solder fillets, and 0201 chips
21 MP Stop-and-Go imaging, True Color LED lighting, Smart Programming
Industrial CMOS cameras, LED illumination rings, precision ballscrew stages

Conformal Coating and Flux Inspection Systems TR7700 CI Series

TR7700 SIII Ultra CI and TR7700 SII Plus CI systems provide automated inspection of protective conformal coatings, flux residues, and dispensed glue. Specialized multi-phase RGB+W+UV lighting paired with laser triangulation enables high-precision coating thickness measurement from 35 to 750 um.

Coating inspection platforms TR7700 SIII Ultra CI and TR7700 SII Plus CI
Polyurethane, silicone, and acrylic conformal coatings on critical PCBA
Multi-phase RGB+W+UV LED lighting, 120 cm2/sec speed, 35-750 um thickness
UV LED illumination modules, optical triangulation sensors, edge clamps

High-Power 3D CT Automated X-ray Inspection Systems TR7600 Series

TR7600HP and TR7600FB SII 3D CT AXI platforms deliver non-destructive volumetric inspection for power modules including IGBTs, MOSFETs, and SiC inverters. Advanced AI-powered void detection algorithms effectively eliminate heatsink artifacts while computing exact voiding percentages.

High-power 3D AXI platforms including TR7600HP, TR7600FB SII, and TR7600 SIII
Automotive power electronics, IGBT modules, high-pin-count BGA packages
Planar CT imaging, AI-Void Detection algorithms, large boards up to 950x530 mm
Sealed microfocus X-ray tubes, digital flat panel detectors, radiation shielding

Modular In-Circuit Testers and MDA Systems TR5001 Series

TR5001E SII and TR8100 SII modular test systems combine manufacturing defect analysis (MDA) with full in-circuit testing and functional verification. Featuring non-multiplexed 1:1 per-pin architecture up to 3456 points, the platform provides automated self-diagnostics and calibration.

Modular ICT and MDA platforms including TR5001E SII, TR518 SII, and TR8100 SII
Electrical parametric verification of analog, hybrid, and digital assemblies
Up to 3456 test points, non-multiplexed 1:1 pin drivers, auto-calibration
Switching relay boards, programmable source units, spring test probe blocks

Semiconductor Wafer Inspection and Metrology Systems TR7950 Series

TR7950Q SII and TR7900Q SII modular platforms are built for advanced wafer inspection and thin-film metrology in ISO Class 5 cleanrooms. Equipped with short-wave infrared (SWIR) sensors, the system identifies subsurface microcracks and measures through-silicon via (TSV) trench depths.

Advanced wafer metrology platforms TR7950Q SII, TR7900Q SII, and TR6850S SII
Wafer inspection for 6", 8", 12" wafers, WLP/WLCSP advanced packaging bump metrology
25 MP imaging, ISO Class 5 cleanroom compatibility, SWIR subsurface detection
Granite base structures, linear motor motion stages, air bearing drive guides

Configuring TR7007 High-Speed 3D SPI Platforms for SMT Lines

TR7007Q SII and TR7007 SIII 3D SPI systems deliver precision solder paste volume, area, and height metrology at speeds up to 200 cm2/sec across fine-pitch circuit boards. The EtherCAT motion architecture and 4-way digital fringe projectors eliminate shadow effects on dense surface mount assemblies.

Equipped with SmartWarp dynamic compensation, the platform eliminates local circuit board deformation errors while supporting Industry 4.0 communication protocols including IPC Connected Factory Exchange and IPC Hermes 9852 standards.

Selecting TR7700 3D AOI Systems for Defect-Free PCBA Production

TR7700Q SII and TR7500QE Plus 3D AOI platforms deliver high-speed optical inspection of assembled surface mount boards up to 57 cm2/sec. The 21 MP Stop-and-Go camera and multi-phase True Color LED lighting capture micro-components down to 0201 with exceptional contrast and zero escapes.

Powered by smart programming with auto-learning capabilities, the system provides accurate coplanarity and solder fillet metrology, simplifying inspection recipes and accelerating production changeovers.

Applying TR7700 CI Inspection to Protect Critical Electronic Boards

The optical design verifies complete coverage of acrylic, polyurethane, and silicone coatings across automotive and industrial boards, identifying bubble formations, cracks, and forbidden keep-out zones.

High-Power 3D CT X-ray Inspection for IGBT and Power Electronics

Accommodating large panels up to 950x530 mm and 12 kg payload, the radiation-safe enclosure protects operators while enabling inline planar CT slice generation for high-density power packages.

Deploying TR5001 Modular In-Circuit Testers on High-Volume Lines

TR5001E SII and TR8100 SII modular test systems combine manufacturing defect analysis with full in-circuit testing and functional verification. Featuring non-multiplexed 1:1 per-pin architecture up to 3456 points, the platform provides automated self-diagnostics and calibration.

The 6-wire analog measurement switching matrix accurately tests resistances, capacitances, and inductances while TestJet vectorless open circuit detection identifies unbonded IC pins without extra fixtures.

Advanced Wafer Metrology and TSV Depth Inspection with TR7950

Handling 6, 8, and 12 inch wafers as well as advanced packaging panels, the platform incorporates granite vibration dampeners and air bearing motion stages to secure sub-micron repeatability.

Test Research Inc / TRI and model names are trademarks of their respective owners and are used only to identify the equipment for which we source parts. SpareX is not an official dealer, distributor or representative of Test Research Inc / TRI and is not affiliated with the trademark owner. Origin, documents and warranty are stated for each item in the quotation.