TSD Semiconductor wafer processing equipment and components

Industrial wafer processing equipment by TSD Semiconductor: advanced TFG automated grinders, IVG dual-spindle thinners, CMP polishing systems, and TSC wafer scrubbers.

TSD TFG series fully automatic wafer grinders

High-throughput TSD TFG-3250 machines provide precision thinning of semiconductor wafers including silicon and silicon carbide. Four rotating index tables and a robust grinding spindle deliver sub-micron total thickness variation and stable surface finish across production runs.

Four independent workstation tables enabling high-throughput continuous wafer indexing
Heavy-duty grinding spindle motor rated at 7.5 kW with closed-loop speed regulation
Standard diamond grinding wheels with OD303 mm outer diameter for stable stock removal
Integrated contact and optical thickness gauges with automated compensation systems

TSD IVG series double-spindle wafer thinners

Semi-automatic TSD IVG-2035 and IVG-3035 grinders are engineered for sequential rough and fine surface thinning of semiconductor substrates from 2 to 12 inches. The dual-spindle architecture and porous ceramic vacuum chuck eliminate stress-induced wafer bow during processing.

Dual-spindle design facilitating sequential transition from coarse grinding to fine polish
Rigid 6.0 kW spindle motor featuring integrated liquid cooling and thermal control
Broad substrate compatibility covering standard wafer diameters from 2 up to 12 inches
Precision diamond grinding wheels with 203 mm outer diameter for delicate material feed

TSD chemical mechanical planarization CMP units

Advanced TSD TPC and TPP-1310 chemical mechanical polishing units provide planarization across silicon wafers, wide-bandgap substrates, and glass panels. Multi-zone pressure heads and optical endpoint detection systems deliver planar geometry prior to thin-film deposition.

Multi-zone membrane carrier head providing uniform radial pressure profiles on wafers
Advanced optical EPD endpoint detection system preventing over-polishing of patterns
Accurate slurry delivery pumps maintaining consistent flow rates and thermal levels
Rigid polishing platens engineered with programmable variable speed and sweep patterns

TSD TSG series automatic strip grinders

Engineered for advanced electronic packaging, TSD TSG-200A grinders specialize in thinning EMC resin strips and integrated circuit substrates. The creep-feed grinding kinematics using twin spindles eliminate delamination and edge chipping across sensitive molded packages.

Specialized creep-feed kinematics for smooth stress-free thinning of epoxy resin strips
Twin motorized spindles rated at 5 kW each for coordinated rough and fine finishing
Broad package capacity handling strip sizes from 100x50 mm up to maximum 300x100 mm
Five independent vacuum clamping zones securely holding workpieces without vibration

TSD TSC series wafer scrubbers and cleaners

TSD TSC-100 and TSC-300S cleaning units deliver post-CMP scrubbing for semiconductor wafers from 2 to 8 inches. Combining soft polyvinyl alcohol PVA roller brushes, megasonic fluid agitation, and clean nitrogen spin drying eliminates particulate defects on substrate surfaces.

Dual-surface scrubbing action using chemical-resistant polyvinyl alcohol PVA rollers
High-frequency megasonic fluid spray effectively removing sub-micron slurry debris
Centrifugal high-speed spin dry cycle under filtered clean nitrogen gas atmosphere
Corrosion-resistant processing chamber built from high-purity chemical polymers

TSD precision spindles and vacuum chuck tables

Replacement spindle assemblies, ceramic vacuum chuck tables, and linear slide guides restore peak factory accuracy across TSD installations. Careful dynamic balancing of grinding spindles minimizes runout vibration and prevents deformation of thin semiconductor slices.

High-precision motorized spindles rated from 5.0 to 7.5 kW with balanced bearings
Porous ceramic chuck tables manufactured with surface flatness deviation under 0.5 um
Precision mounting hubs and flanges for diamond grinding wheels OD203 and OD303 mm
Complete sets of protective bellows, fluid seals, and preloaded linear guide rails

Precision wafer thinning and grinding technology by TSD

The advanced wafer thinning and grinding machinery developed by TSD Semiconductor delivers high geometric precision across semiconductor substrates. In thinning silicon, silicon carbide, and gallium nitride wafers, maintaining minimal total thickness variation and surface roughness is critical.

TSD equipment incorporates high-rigidity spindle units mounted on precision hydrodynamic or aerostatic bearings that eliminate radial and axial runout.

Deploying fine-grit diamond cup wheels combined with temperature-controlled coolant delivery guarantees consistent stock removal while preventing micro-crack propagation.

Multi-stage grinding sequences and automated thickness control

TSD TFG series automated wafer grinders execute multi-step grinding cycles divided into aggressive rough grinding, intermediate smoothing, and final fine polishing. Built-in contact probe gauges and non-contact optical sensors continuously track residual wafer thickness in real time.

Upon approaching target dimensions, the numerical controller adjusts spindle downfeed velocity and reduces applied load. An integrated overload monitoring algorithm retracts the grinding tool when cutting resistance rises, protecting crystal lattices from thermal shock and thin wafers from breakage.

Chemical mechanical planarization for advanced substrates

The TPC and TPP-1310 series chemical mechanical planarization units deliver planar surface finishing for silicon wafers, silicon carbide crystals, and large-format glass panels.

The planarization process balances chemical reactions from colloidal slurry formulations with mechanical micro-abrasion from a rotating polishing pad. A multi-zone membrane carrier head permits independent pressure regulation across central, middle, and perimeter zones of the workpiece.

Integrated optical endpoint detection systems identify precise process completion, preventing over-polishing.

Creep-feed grinding for encapsulated strip packaging

Specialized TSG series grinders are engineered for mechanical finishing of molded electronic packaging strips and epoxy resin matrices. Continuous creep-feed kinematics remove substantial packaging compound in minimal grinding passes without causing edge chipping or layer separation.

A dual-spindle configuration unites coarse and fine processing within a compact footprint. Five independent vacuum clamping zones on the chuck table prevent substrate flexing under cutting forces, while integrated extraction filtration captures fine polymer dust and debris.

Post-CMP wafer scrubbing and high-speed drying systems

TSC series cleaning units complete the semiconductor substrate manufacturing sequence by removing residual polishing slurry, abrasive particles, and chemical residues.

The cleaning procedure employs dual-sided polyvinyl alcohol PVA roller brushes with high hydrophilicity that gently scrub substrate surfaces without inducing scratches. Megasonic piezoelectric transducers deliver high-frequency fluid agitation to dislodge sub-micron particles.

Following rinsing, substrates transfer to a spin chamber for rapid centrifugal drying under a clean filtered nitrogen flow.

Preventive maintenance guidelines and component replacement

Maintaining factory performance across TSD Semiconductor installations requires scheduled preventive maintenance procedures. Technicians regularly inspect spindle runout, ceramic chuck table planarity, sealing membrane resilience, and chemical peristaltic pump delivery rates.

Technical selection of replacement components is executed using machine serial plates and plant specifications. Routine replacement of worn filter cartridges, PVA brush rollers, and linear guide elements preserves production continuity and prevents unexpected downtime.

TSD Semiconductor and model names are trademarks of their respective owners and are used only to identify the equipment for which we source parts. SpareX is not an official dealer, distributor or representative of TSD Semiconductor and is not affiliated with the trademark owner. Origin, documents and warranty are stated for each item in the quotation.