ADT Precision Dicing Saws and Diamond Blades

Comprehensive technical supply of ADT automated dicing saws, precision diamond blades, high-speed air bearing spindles, and water treatment systems for semiconductor manufacturing facilities.

Automatic and semi-automatic dicing systems ADT 71xx and 72xx series

Precision dicing systems across 7100, 7122, 7152, and 7200 series provide accurate singulation of silicon wafers, glass substrates, and technical ceramics up to 200 mm diameter. Equipment features a single spindle configuration, closed-loop motion control, and high-resolution vision.

Precision dicing of semiconductor wafers and optical substrates up to 200 mm diameter
Single air bearing spindle design operating smoothly up to 60000 rpm rotation speeds
Automated pattern recognition vision system correcting wafer rotational misalignment
Integrated vacuum chuck workpiece holding table and programmable DI water coolant flow

Dual spindle fully automatic dicing equipment ADT 80xx and 82xx series

High-throughput dicing systems across 8020, 8030, 80Ai, and 8230 series deliver continuous singulation of wafers up to 300 mm diameter. Twin independent high-speed spindles execute synchronized dual-cut and step-dicing sequences across microelectronic panels and dense matrices.

Processing of 300 mm semiconductor wafers and high-density electronic package panels
Dual independent air bearing spindles executing simultaneous and stepped dicing modes
Automated cassette-to-cassette wafer handling robotics with safety interlock protection
Non-contact height measurement setup monitoring blade immersion and cut depth profile

Diamond dicing blades on organic resin bond formulation Resin-Bond

Thermosetting resin bond diamond blades provide reliable dicing of brittle materials including QFN, DFN packages, thick ceramic substrates, LTCC modules, and glass. Tool thickness extends from 75 to 2500 micrometers with diamond grit sizes ranging between 3 and 250 micrometers.

Controlled matrix wear rate maintaining continuous self-sharpening diamond action
Minimization of package edge chipping and delamination across QFN and ceramic wafers
Extensive working thickness spectrum from 75 to 2500 micrometers for varied kerf widths
Specialized bond formulation lowering thermal build-up and tool load during singulation

Electroplated nickel bond blades and integral hub dicing blades

Electroplated nickel bond blades ranging from 50 to 300 micrometers provide extended working lifetime when singulating silicon wafers, PCBs, and BGA substrates. Integral hub blades deliver high structural rigidity and minimal lateral runout for GaAs, PZT, and discrete devices.

Hard electroplated nickel bond layer providing low wear rate in abrasive applications
Integral aluminum hub structure eliminating blade deflection in deep wafer trenches
Reduced top-side and backside edge chipping on silicon and compound semiconductor dice
Fine dynamic balancing suppressing vibration transmission into high-frequency spindles

High-speed air bearing dicing spindles and precision blade flanges

Precision air bearing spindles reaching operational speeds up to 60000 rpm are produced in 2-inch and 4-inch variants. Spindle assemblies incorporate dynamically balanced mounting flanges, calibrated DI water cooling manifolds, and continuous non-contact height sensors.

Frictionless air bearing rotor suspension delivering exceptional operational durability
High radial and axial stiffness maintaining cut path stability under heavy work loads
Precision balanced clamping flanges ensuring true concentric alignment of hubless blades
Calibrated coolant delivery nozzles ensuring uniform fluid film inside dicing trenches

Dicing peripheral equipment for water treatment, cleaning, and tape mounting

The peripheral production suite comprises AR-927 water recycling units, AB-47 and 947 CO2 gas bubblers for water resistivity stabilization, 966 and 967 tape mounters, 977 wafer cleaners, and AV-57 LED ultraviolet adhesive curing systems.

Closed-loop cutting water recycling system AR-927 featuring multi-stage microfiltration
Carbon dioxide injection bubbler AB-47 stabilizing DI water resistivity during dicing
Semi-automatic wafer tape mounting system 967 delivering uniform tension across film
High-output LED ultraviolet exposure chamber AV-57L for rapid tape adhesive release

Precision dicing technology for semiconductor wafers and dice

ADT automated dicing systems are engineered for singulating semiconductor silicon wafers, gallium arsenide dies, sapphire substrates, technical ceramics, and optical glass.

High-resolution positioning across X, Y, Z, and rotational Theta axes delivers submicron indexing accuracy between integrated circuit street lines. High-speed air bearing spindles stabilize blade rotation without runout or mechanical vibration.

Programmable deionized water delivery manifolds cool the diamond cutting zone, wash away silicon swarf, and eliminate thermal stress and edge micro-chipping. Advanced vision systems automatically align cutting paths to topological fiducials.

Diamond dicing blades: matrix formulations and tool optimization

Achieving stable dicing throughput depends on matching diamond blade properties to substrate mechanics. Thermosetting resin bond diamond blades feature an elastic matrix with controlled self-sharpening action, eliminating edge chipping on brittle QFN, DFN, LTCC, and optical glass substrates.

Electroplated nickel bond blades deliver exceptional wear endurance for silicon wafers and printed circuit boards. Integral hub blades provide superior axial rigidity for deep wafer trenches.

Periodic tool dressing against dedicated abrasive conditioning blocks restores diamond protrusion and edge geometry.

Dual spindle dicing platforms: synchronized and step-dicing modes

Flagship ADT 8020, 8030, and 80Ai platforms incorporate twin independent high-frequency air bearing spindles with dedicated feed mechanisms.

This dual architecture supports two productive operating modes: synchronized parallel cutting across adjacent streets to double throughput, and sequential step dicing.

In step dicing mode, the leading spindle with a wider blade cuts through top passivation and metal layers, while the trailing spindle with a thinner blade completes through-substrate wafer singulation. This technique completely eliminates structural stress and front-side chipping.

High-speed air bearing spindles and precision blade clamping flanges

Dicing spindle units utilize non-contact aerostatic air bearings supplied with dried compressed air up to 6 bar, operating smoothly from 10000 to 60000 rpm. The total absence of physical contact ensures high rotational accuracy with radial runout under 0.5 micrometers.

Hubless diamond blades are secured by precision balanced clamping flanges produced from heat-treated alloy with tight face parallelism tolerances. Slurry ingress into the spindle bearing housing is prevented by continuous positive pressure air purge labyrinth seals.

Peripheral water treatment and cutting fluid closed-loop recycling

Consistent semiconductor dicing demands continuous high-purity coolant delivery. AR-927 closed-loop water recycling units provide multi-stage submicron filtration of silicon slurry, reducing fresh DI water consumption across cleanroom facilities.

Specialized carbon dioxide bubbler stations AB-47 and 947 inject carbon dioxide into deionized water, maintaining stable fluid resistivity between 0.2 and 1.2 megohm-cm.

This controlled conductivity dissipates electrostatic charges generated during high-speed dicing, protecting sensitive integrated circuits from electrostatic discharge damage.

Wafer tape mounting, high-pressure cleaning, and ultraviolet curing

Post-dicing semiconductor workflows rely on auxiliary tape mounting, wafer cleaning, and die release equipment. Semi-automatic 966 and 967 mounting stations apply semiconductor wafers onto adhesive dicing film held on stainless steel film frames without air pockets or localized film tension.

After dicing completion, wafers enter the 977 spin-rinse dryer where high-pressure atomizing nozzles remove residual debris followed by dry nitrogen drying.

Film frames then transfer to the AV-57L ultraviolet LED curing chamber, where ultraviolet photons rapidly decompose the adhesive bond for clean die pickup.

ADT and model names are trademarks of their respective owners and are used only to identify the equipment for which we source parts. SpareX is not an official dealer, distributor or representative of ADT and is not affiliated with the trademark owner. Origin, documents and warranty are stated for each item in the quotation.