AcSiP LoRa, GNSS and Wi-Fi modules

S76S / S78S

These 13 × 11 × 1.1 mm LGA modules pair an STM32L073 MCU with a Semtech LoRa transceiver: the S76S (SX1276) covers EU868/US915 and the S78S (SX1278) covers 433/470 MHz.

Since the package and pinout are identical, a replacement request should include the full marking, the frequency band and any available firmware details.

S76G / S78G

The S76G and S78G combine a LoRa radio, STM32L073Z microcontroller and Sony CXD5603GF GNSS receiver in a 13 × 11 × 1.55 mm package. They provide separate RF and GNSS antenna connections and use 3.3 V and 1.8 V supply domains.

State the full model, radio region and the navigation function required by your device. Include the board documentation when requesting a replacement. S76G covers EU868, US915 and AS923; S78G covers CN470 and EU433.

ST50H, ST50HE and ST50L

ST50H, ST50HE and ST50L are LoRa SiP modules with a Cortex-M4 microcontroller. ST50H and ST50HE serve the higher-frequency bands with different output-power configurations; ST50L is the lower-band version.

Selection should follow the complete model designation, frequency requirements and the device design. The manufacturer also offers corresponding EK evaluation kits for development and testing. ST50HE specifies output power up to +14 dBm.

S62F / S68F

These 9 × 8 × 1.26 mm LGA modules with an embedded 32 MHz TCXO and up to +22 dBm output are driven by an external MCU over SPI; the S62F (SX1262) covers 865–928 MHz and the S68F (SX1268) covers 433–510 MHz.

The packages are identical, so the full marking and the device's operating band are needed to source a replacement.

AI7933CLD / AI7931LD

Both use a 300 MHz Cortex-M33 (MediaTek Filogic platform), support dual-band 802.11a/b/g/n/ac/ax 1T1R Wi-Fi and carry 16 MB of flash and an IPEX connector for an external antenna.

The AI7933CLD adds a HiFi4 audio DSP and 8 MB of pSRAM versus 4 MB on the AI7931LD, so check the full marking and required features when replacing.

EK-S76SXB / EK-ST50H / EK-S62F / EK-AI7933CLD

Kits such as EK-S76SXB, EK-ST50H, EK-S62F and EK-AI7933CLD are boards carrying an AcSiP module with interface headers; the EK-S76SXB, EK-ST50H and Wi-Fi kits add a USB connection and an antenna, while the EK-S62F is driven by an external MCU over SPI.

A kit does not replace a module soldered into a device, so give the exact kit name and frequency version in the enquiry. EK-ST50H provides Arduino Uno V3 and ST morpho headers with ST-Link.

A module, a radio IC or an evaluation board

An order should identify the required assembly level. A radio IC is a chip; a SiP module has its own package, connections and supporting circuitry; an evaluation kit is a board carrying the module and development interfaces.

A reference to SX1276 in equipment documentation does not by itself identify the replacement part. Start with the marking on the installed component and the board parts list. For an EK-S76SXB enquiry, state that you need the kit rather than the LGA module.

If your project needs both, list them separately with individual quantities. This keeps prototype equipment and production components distinct throughout the quotation.

Choosing between S76S, S76G and S62F

The S76S integrates a microcontroller and communicates with the host through UART. The S62F is a transceiver controlled by an external MCU over SPI. Choosing between them affects board routing, host commands and the allocation of functions in the product.

For a repair, provide the exact installed model; for a new design, describe how the radio connects to the main controller. The S76G also includes satellite positioning and requires attention to both antenna paths and its supply domains.

If only positioning has failed, explain that separately from radio communication. The enquiry should describe the function you need to restore, together with the component identification.

When the full part number is missing

Send the information you still have: photographs of the module and board, the equipment model, a manual, a schematic excerpt or a previous bill of materials. Show where the component sits and how many identical boards are involved.

If the marking is worn, attach a close-up and distinguish readable characters from guesses. Where several document revisions exist, identify the one used for your equipment. The equipment model, board revision and module designation complement one another.

A photograph of an intact unit can also help identify the position. For multiple items, use one table row per module, variant and quantity, with a reference to its photograph or drawing.

Specifying a Wi-Fi integration project

The AI7933CLD and AI7931LD share a platform but differ in audio-processing functions and memory. Explain whether the device uses audio, which peripheral interfaces are connected and which software environment is available.

For an existing design, include its bill of materials and the installed module designation. Wi-Fi alone is not a complete specification for an embedded component. Record the antenna connector, physical placement and space available inside the enclosure.

For an evaluation kit, list required accessories and the power source separately. For production supply, state whether you need bare modules or assembled boards. These details help frame the enquiry around the actual engineering and purchasing task.

Planning evaluation in the target device

For a prototype order, define the checks you will carry out on your board: startup, host communication, network connection, data transfer and the functions used by the application. Record firmware and network settings so the results refer to a specific configuration.

If the objective is a replacement for a production item, include the original specification. On receipt, compare the delivered marking and quantity with the agreed item list and keep packaging and accompanying documents for incoming inspection.

For a repeat order, use the previously agreed designation and list any board or firmware changes separately. Keep navigation, radio-data and local-network components distinct if the device contains more than one wireless module.

Repeat orders and purchasing documents

For a repeat purchase, send the previously agreed specification and explain what has changed: quantity, board revision, delivery destination or document requirements. Keep the full model designation rather than reducing it to a brand name.

If modules are intended for different equipment models, show the allocation for each device. Separate model documentation from documents requested for the actual shipment. A technical description supports selection, while shipment paperwork follows the agreed procurement requirements.

Mention packaging and identification requirements before quotation, particularly when the modules will be supplied to an assembly line alongside other electronic components. For prototypes and planned production volumes, provide separate quantities and explain the intended acceptance process.