EO Technics Semiconductor and Industrial Laser Equipment

Technical equipment catalog of EO Technics (South Korea): CSM and WTM wafer laser markers, LAton laser annealing systems, LMC3200 grooving dicing tools, WD400U laser debonding, and 4000U PCB laser drilling platforms. Global equipment supply for semiconductor fabs and packaging plants.

Wafer Level Laser Marking Systems CSM and WTM Series

EO Technics CSM and WTM series deliver high-speed laser marking on 200 mm and 300 mm silicon wafers without chip damage. Features include automated scanner compensation and machine vision inspection. Fully compatible with bare wafers and film-frame carriers.

Wafer level laser markers including CSM2000, CSM3000, WTM200, and WTM300
Backside wafer marking, bad die ID, and cleanroom semiconductor traceability
Automated scanner calibration, inline OCR editing, 200/300 mm wafer handling
Galvo scanners, telecentric f-theta lenses, optical sensors, robotic end-effectors

Multi-Beam Strip and Package Laser Markers SC, SVL, and SFL Series

EO Technics multi-beam strip markers deliver high-throughput laser marking for IC packages with shuttle or rail handlers. Configured with CO2, DPSS Nd:YVO4, or fiber lasers to match mold compounds and metals. Machine vision provides individual unit alignment.

Multi-beam strip marking systems SC, SVL, SFL, and SLD series
Package marking on EMC mold compounds, plastics, ceramics, and alloy leads
4-beam architecture, shuttle and rail transfer, unit-level vision alignment
Laser resonators, indexing stepper motors, rail guides, optical mirrors

Wafer Grooving and Laser Dicing Systems LMC3200 Series

LMC3200G and LMC3200D systems deliver laser grooving and dicing for thin semiconductor wafers under 200 µm. The non-contact laser process strips low-k dielectric layers along sawlanes, preventing chipping. Eliminating blade wear significantly lowers cost of ownership.

Laser grooving and dicing systems LMC3200G, LMC3200D, and SDR series
Silicon wafers, low-k dielectric stacks, GaAs, and sapphire substrates
Sub-200 µm wafer processing, zero-contact cutting, edge chipping elimination
Ultra-short pulse lasers, porous vacuum chucks, debris extraction nozzles

Selective Laser Annealing Platforms LAton and LAton-R Series

EO Technics LAton and LAton-R platforms deliver precision thermal laser annealing for wafer crystallization, dopant activation, and defect removal. Tailored for SiC nickel silicide ohmic contacts and backside IGBT annealing. In-situ monitoring ensures pulse uniformity.

Thermal laser annealing platforms LAton and LAton-R series
Si dopant activation, SiC nickel silicide contacts, IGBT backside annealing
Custom beam shaping, selective wavelengths, real-time thermal monitoring
Beam homogenizers, optical collimators, pyrometric sensor modules

Precision Laser Debonding Systems WD400U and BMDB400UPN Series

WD400U and BMDB400UPN systems provide rapid, stress-free laser debonding for thin wafers and panels in WLP and PLP packaging lines. The laser cleanly releases temporary adhesive bonds from rigid carrier plates. The process minimizes thermal and warpage stress on sensitive dies.

Laser debonding systems WD400U and BMDB400UPN series
Temporary bond release for ultra-thin wafers and WLP/PLP packaging panels
Fast cycle throughput, minimum substrate stress, high warpage tolerance
UV laser heads, line-beam optical delivery, vacuum substrate holders

High-Speed Laser Drilling Systems for PCBs and POP Packages 4000U and BMC Series

EO Technics 4000U and 5000U UV laser drilling systems are engineered for micro-vias in HDI PCBs and flexible circuits. The Neo scan architecture enables micron-level beam control at high repetition rates. System BMC204P provides specialized via-drilling for Package on Package ICs.

UV laser drilling platforms 4000U, 5000U, and POP drilling system BMC204P
HDI multi-layer PCBs, flexible circuits, specialty metal foils, POP strips
Neo scan high-speed beam control, flying processing mode, zero burnt rim
UV optical beam paths, servo motion controller boards, vacuum bed fixtures

Proprietary Industrial Fiber and Pulsed Laser Sources EF and Powerlase Series

EO Technics manufactures in-house laser engines, including EF20 and EF40 pulsed fiber lasers featuring seed-LD pulse width modulation from 4 to 1000 ns. Subsidiary Powerlase supplies high-energy pulsed sources. Modular source engineering ensures straightforward field maintenance.

In-house laser engines EF20, EF40, DDL, and Powerlase pulsed modules
Optical engines for marking, micro-cutting, precision welding, and stripping
Adjustable pulse width 4–1000 ns, pulse energy to 1 mJ, TEM00 beam quality
Diode pump modules, optical fiber combiners, protective output connectors

Configuring CSM and WTM Precision Laser Wafer Marking Systems

EO Technics CSM and WTM series wafer markers deliver high-speed laser marking on 200 mm and 300 mm silicon substrates with zero thermal damage to active dies. The integrated automatic scanner calibration compensates for optical drift, ensuring compliant DataMatrix and OCR readability.

The platform handles both film-frame carrier (FFC) mounted wafers and bare wafers, meeting SEMI cleanroom class standards for frontline semiconductor fabrication.

Multi-Beam Strip Markers SC, SVL, and SFL for Semiconductor Assembly

For semiconductor back-end assembly and IC packaging lines, EO Technics provides 4-beam strip markers with shuttle or rail indexing handlers. Source selection is customized by package material: CO2 lasers for polymers, DPSS Nd:YVO4 for EMC mold compounds, and fiber lasers for ceramics and metals.

The inline vision alignment system provides individual unit compensation across the strip, overcoming accumulated packaging tolerances.

Deploying LMC3200 Laser Grooving and Thin Wafer Dicing Systems

LMC3200G and LMC3200D systems provide non-contact laser removal of top metal layers and brittle low-k dielectrics along wafer sawlanes prior to dicing. This process eliminates chipping, delamination, and microcracks at die edges.

For wafers under 200 µm thickness, the LMC3200D achieves complete non-contact laser dicing without blade consumption or deionized water contamination.

Selective Thermal Laser Annealing on Silicon and SiC with LAton Platforms

LAton and LAton-R thermal laser annealing platforms are engineered for dopant activation, silicon crystallization, and surface void elimination without substrate thermal overload.

Critical for power device manufacturing, including nickel silicide ohmic contact formation on silicon carbide (SiC) and backside IGBT activation.

Custom beam shaping optics and real-time process monitoring ensure pulse-to-pulse energy stability across the entire wafer surface.

High-Speed Micro-Via Laser Drilling for PCBs and POP Substrates

EO Technics 4000U and 5000U UV laser drilling platforms featuring Neo scan architecture produce blind and through micro-vias in high-density interconnect (HDI) PCBs and flexible circuits without dielectric burning.

The specialized BMC204P platform delivers high-speed via drilling for Package on Package (POP) IC substrates in flying processing mode.

EO Technics and model names are trademarks of their respective owners and are used only to identify the equipment for which we source parts. SpareX is not an official dealer, distributor or representative of EO Technics and is not affiliated with the trademark owner. Origin, documents and warranty are stated for each item in the quotation.