Convection and Vacuum Reflow Soldering Systems Heller Industries / Heller

Heller Industries convection reflow ovens MK7, MK5, short-cycle vacuum systems SCVR, pressure curing ovens PCO, and vertical curing ovens VCO. Industrial equipment selection.

MK7 Flagship Convection Reflow Soldering Systems

Heller MK7 series convection reflow ovens deliver industry-leading thermal uniformity with minimal delta T, double-insulated low height shells saving 10-15% energy, and Uniform Gas Management cutting nitrogen consumption by up to 40%.

MK7 platform models 1809, 1826, 1913, 1936, 2043, 2049, 2156
Lead-free assembly of high-density interconnect circuit boards
Dual-layer insulated shell & advanced Uniform Gas Management
Semi-circular heaters, blower fan motors & flux collection jars

Short-Cycle Vacuum Reflow Soldering Systems SCVR

Heller SCVR short-cycle vacuum reflow ovens feature an innovative multi-stage board transmission mechanism that increases line throughput up to 100%. The vacuum chamber integrates 3 infrared heating panels to drive solder joint voiding rates below 1%.

SCVR vacuum modules built on 1936 and 2043 tunnel platforms
Automotive-grade IGBT/SiC power modules and Micro LED assembly
Solder joint voiding reduced below 1% with 3 internal IR panels
Fluoroelastomer chamber seals, vacuum valves and conveyor drives

MK5 Series Proven Convection Reflow Systems

The proven Heller MK5 convection reflow series delivers continuous PCB soldering for medium and high-volume electronics manufacturing. Balanced airflow across multiple thermal zones ensures tight temperature consistency across demanding lead-free solder alloys.

Industrial MK5 models across 1707, 1809, 1826, 1913, 1936 series
High-volume surface mount assembly for industrial electronics
Balanced convection airflow modules and rapid tunnel cooling
Conveyor drive chains, PCB support pins, bearings and heater rods

PCO Series Pressure Curing and Reflow Systems

Heller PCO pressure curing ovens combine regulated chamber pressure with forced convection to eliminate micro-voids in epoxy polymers. The systems support underfill curing, die attach, and thermal interface material lid mounting on semiconductor wafers up to 300 mm.

Batch and in-line PCO systems supporting 300 mm silicon wafers
Semiconductor underfill curing, die bonding & TIM lid attachment
Forced convection heating under regulated nitrogen pressure
Pressure relief valves, pressure transducers & chamber seals

VCO Vertical Continuous Curing Systems

Heller VCO vertical continuous curing ovens minimize cleanroom footprint while accommodating multi-hour polymer curing profiles in less than six feet of floor space. The VCO 290 platform delivers uniform 30-minute thermal profiles for boards and pallets up to 350x350 mm.

Continuous in-line vertical curing systems including VCO 290
Cleanroom epoxy curing for automotive sensors and electronics
Footprint under six feet with uniform 30-minute thermal curve
Vertical elevator drives, pallet guide rails and thermocouples

Formic Acid and Vacuum Reflow Systems VFAR

Heller VFAR systems integrate formic acid vapor with vacuum processing for fluxless semiconductor soldering. By chemically reducing oxides without liquid flux, the process eliminates post-reflow deflux washing during wafer bumping, flip-chip attach, and ball grid array assembly.

Fluxless formic acid ovens FAR and combined vacuum units VFAR
Wafer bumping, flip-chip die attach, and BGA ball bonding
Chemical oxide reduction via HCOOH vapor without liquid flux
Acid bubblers, vapor mass flow controllers and vacuum seals

Replacement Parts, Heaters and Conveyor Assemblies

We supply replacement components and wear assemblies for Heller convection and vacuum reflow ovens, including semi-circular heating elements, convection blowers, conveyor chains, support pins, oxygen sensors, and thermocouple modules, identified via machine nameplate.

Components for Heller MK7, MK5, SCVR, PCO and VCO platforms
Preventative maintenance and line conveyor refurbishments
Semi-circular heater modules, PPM oxygen probes & PID relays
Conveyor pin chains, stainless mesh belts & blower impellers

Engineering Maintenance, Calibration and Service Support

Our technical engineering team delivers preventative maintenance, on-site delta T profiling, nitrogen management checks, flux condenser system cleaning, and turnkey commissioning for Heller reflow and curing systems across demanding electronics manufacturing facilities.

Comprehensive service for Heller reflow and curing systems
Thermal profiling diagnostics and gas tightness verification
Qualified field service engineers and preventative overhaul
Flux condensation maintenance, motor balancing & calibration

Selecting Heller MK7 Convection and SCVR Vacuum Systems for SMT Production

For automotive-grade power modules and high-reliability Micro LED assemblies, the short-cycle vacuum reflow module SCVR integrates 3 internal infrared heating panels to reduce solder joint voiding below 1% without sacrificing production line throughput.

Integrating PCO Pressure Curing and VCO Vertical Systems into Cleanrooms

Heller PCO pressure curing systems eliminate micro-voids during underfill curing and thermal interface material lid mounting on wafers up to 300 mm.

For footprint-constrained cleanrooms, VCO 290 vertical ovens provide continuous in-line curing with a uniform 30-minute thermal profile in less than six feet of floor space.

Heller Industries and model names are trademarks of their respective owners and are used only to identify the equipment for which we source parts. SpareX is not an official dealer, distributor or representative of Heller Industries and is not affiliated with the trademark owner. Origin, documents and warranty are stated for each item in the quotation.