Bungard Elektronik PCB prototyping equipment
Define a PCB prototyping workcell by Bungard Elektronik model, board format, process sequence and the equipment already installed.
CCD/2/ATC drilling and milling
The CCD/2/ATC combines PCB drilling and milling with automatic tool changing. For a spindle, collet or control assembly, provide the exact machine version, component marking and connection photographs.
- CCD/2/ATC working area: 270 × 325 × 38 mm
- Automatic tool change, ATC
- Request data: nameplate and assembly reference
Hellas LED vacuum exposure
Hellas LED is used for UV exposure. Identify the machine configuration before selecting a vacuum component, contact-frame part or light-source assembly; include the markings of the installed components.
- Exposure area: approximately 575 × 365 mm
- Double-sided version: 2 × 84 LEDs
- Request data: configuration and component photographs
Splash and Splash XL etching
Splash combines spray etching with a static rinse section. For a chamber, heating or temperature-control component, specify the model, process medium and the component position in the machine documentation.
- Splash etching format: up to 210 × 300 mm
- Splash XL format: up to 300 × 400 mm
- Thermostatic etchant temperature control
Compacta 30 through-hole plating
Compacta 30 supports galvanic through-hole plating. A request for a tank, movement or power-supply assembly should identify its location, installed component markings and the required scope of replacement.
- Usable board format: 200 × 300 mm
- Five treatment tanks plus an electroplating tank
- Request data: diagram and component marking
Favorit rivets and tooling
Favorit makes mechanical connections between the sides of a double-sided board using hollow rivets. Specify board thickness, hole dimensions and the installed tool reference when requesting rivets or replacement tooling.
- Mechanical connection using a hollow rivet
- A different process from galvanic through-hole plating
- Request data: rivet dimensions and tool reference
RMP 210 and RMP 3545 multilayer presses
RMP presses are used to manufacture multilayer boards. Identify the press model and installed component before selecting a heating, pressure or control assembly; provide the relevant documentation reference.
- RMP 210 usable format: 210 × 300 mm
- RMP 3545 usable format: 300 × 400 mm
- Request data: stack structure and assembly reference
SMT 3000 component placement
SMT 3000 is a manipulator for prototypes and small production batches. A pickup, dispensing or board-holder request should describe the workstation configuration and show the tooling currently installed.
- Manufacturer placement figure: 300–600 SMD per hour
- Maximum board size: 440 × 245 mm
- Request data: component type and installed tooling
RLM 419 P dry-film laminator
RLM 419 P applies dry-film resist. For a roller, transport or temperature-control assembly, specify the laminator configuration, material width and the marking of the required component.
- Lamination width: up to 400 mm
- Lamination speed: 0.2–1.2 m/min
- Roller temperature range: 20–120 °C
Identify the machine and assembly
Start with an overall photograph of the machine and a clear image of its nameplate. Show the required assembly from both sides and indicate where it is installed. Copy the complete reference, including letters, numbers and suffixes.
If the component has already been removed, include the mounting location and mating part. For several items, use a numbered list with quantities and separate photographs. This links each request to a defined configuration before a replacement or equipment package is considered.
Board size and process requirements
Finished board dimensions and the dimensions of the process blank can differ. Provide both sizes, the material thickness and the operation required. A press request also needs the stack dimensions, while exposure selection needs the artwork field.
An etching request should explain how the board is held. When several machines form a workcell, check that the blank can pass through every operation. Describe the present task and a planned larger format separately, so the equipment scope reflects both requirements without confusing them.
CCD spindle, collet and controls
For a CCD assembly, state the complete machine designation, the installed spindle and the tool-changing arrangement. A collet request benefits from its marking, mounting dimensions and photographs of the assembled and removed part.
For an electrical component, include its label, connectors and connection diagram. Keep the required spare part separate from cutting tools and software. If the request follows a configuration change, describe the sequence of events and include the displayed message.
Similar appearance alone does not establish interchangeability between components.
Exposure and image preparation
Exposure equipment selection starts with the material format, single-sided or double-sided operation and the resist being used. For an existing machine, show the contact surface, vacuum connections and the light-source marking.
List a complete machine and a replacement component as separate request items. If artwork preparation or imaging is already available in the laboratory, explain the current workflow.
This allows the equipment package to be assessed against the actual process, with a clear distinction between operations already covered and the functions that need to be added.
Wet processing and rinsing
A component used in an etching or plating machine needs more identification than its outside dimensions. State the process medium, the operating conditions from your process documentation and where the component contacts liquid. For a hose, seal or fitting, include mating dimensions and photographs.
For a heating or control item, provide the electrical marking and diagram. Etching, developing and plating are distinct operations. Label each machine and assembly separately in the request so the replacement scope can be checked item by item.
Mechanical connections and plating
Favorit and Compacta address different process requirements. Favorit creates mechanical connections with hollow rivets; Compacta belongs to a galvanic process. For Favorit, specify hole dimensions, board thickness, the rivets being used and the tools already installed.
For Compacta, identify the requested machine assemblies and explain the existing process configuration. When choosing equipment for a new board design, describe how the layers must be connected.
Selecting the process first makes it easier to define machines, tooling and process materials without treating these separate tasks as interchangeable.
Dry-film lamination and rollers
For an RLM request, provide the machine designation, film type and width, blank thickness and the settings recorded in your process sheet. Roller selection needs photographs of the surface, ends and mounting arrangement.
A drive or sensor request also needs its component marking and connection information. If the issue concerns the result on the board, show the processed material and explain when the defect appears. This helps distinguish a component requirement from a process-setting question.
Film processing conditions are checked against the documentation for the selected material.
Define the multilayer press stack
Press selection requires the blank size, layer structure, stack thickness and material information from the intended process. State usable board dimensions separately from the outside dimensions of the pressing stack.
For a heater, sensor or control component, provide the installed reference and the relevant assembly diagram. List requested accessories beside the machine rather than leaving the equipment scope implicit.
The workcell cycle includes stack preparation and cooling as well as pressing, so the plate dimensions alone do not describe the output of the complete multilayer workflow.
Configure an SMT workstation
For SMT 3000, describe the board format, the components to be placed and how materials reach the workstation. List board holders, pickup items and dispensing components separately. A spare-part request should show the installed assembly and its reference.
The manufacturer's placement figure is a comparison point; the real workstation cycle depends on the board and the working method. For a wider assembly package, also describe the operations immediately before and after placement.
This defines the workstation scope more clearly than a machine designation alone.
Integrate with the existing workcell
Prepare a short process sequence from the incoming blank to the required finished board. Identify the machines already installed and the operations that need additional equipment. State the expected workload, available space and placement constraints.
Define the supply scope explicitly: machines, accessories, tooling, data preparation and additional services are separate items. If part of the process is performed elsewhere, include that information in the initial brief.
The resulting configuration can then be checked against the real production route and discussed as a list of defined items.
Utilities and site preparation
Before confirming the equipment scope, collect information about the electrical supply, ventilation, water, drainage and other utilities relevant to the selected machines. Exact requirements come from the documentation for each configuration.
A room plan, access dimensions and service space are useful for the placement review. Identify who prepares the connections and which installation activities need to be included. Discuss these points together with the machine package before dispatch.
Photographs of the existing workstations can help clarify the starting conditions without requiring a complete facility design at the enquiry stage.
Prepare a checkable specification
List the machine models, assemblies and quantities, then attach photographs and available documentation pages. Mark mandatory items and options that can be assessed separately. The quotation review should match each component description, configuration and accessory scope to the stated requirements.
When the task changes, update the item list while keeping stable line references so versions remain comparable. For equipment, define packaging, acceptance documents and any requested services separately.
This makes the agreed specification easier to check before dispatch and helps the receiving team compare the delivered package with the request.
Related manufacturers
Bungard Elektronik and model names are trademarks of their respective owners and are used only to identify the equipment for which we source parts. SpareX is not an official dealer, distributor or representative of Bungard Elektronik and is not affiliated with the trademark owner. Origin, documents and warranty are stated for each item in the quotation.
