Possehl / Possehl Electronics electromechanical components and lead frames

German engineering in precision electromechanics, copper lead frames for semiconductors, pretPin press-fit contacts, and hybrid housings by Possehl / Possehl Electronics.

Possehl copper lead frames for semiconductor packaging

Possehl Electronics precision lead frames are manufactured from high-grade copper alloys using high-speed stamping and chemical etching. They deliver superior thermal dissipation and dependable semiconductor die attachment across advanced microelectronic assemblies.

Precision stamped and etched copper lead frames for integrated circuit packaging
High thermal dissipation copper alloys ensuring dependable junction temperatures
Delivery in continuous reel-to-reel and strip formats for automated feeder lines
Tight lead pitch tolerances designed for high-density microelectronic placement

Possehl solderless press-fit contact systems pretPin

Patented pretPin elastic press-fit contacts by Possehl Electronics enable solderless interconnection into metallized printed circuit board holes through mechanical insertion. They ensure exceptional joint retention and vibration resilience without thermal shock.

Solderless press-fit pin insertion into metallized printed circuit board holes
Elastic radial retention zone forming a reliable gas-tight electrical interface
Elimination of thermal soldering stresses and chemical flux residue on circuits
High resilience against thermal cycling and continuous mechanical vibrations

Possehl metal-plastic hybrid housings for automotive electronics

Possehl Electronics hybrid housings are produced by insert-molding precision stamped metal grids within engineering polymers. The assemblies integrate connection terminals, sensor cavities, and structural mounting points into an integrated mechatronic module.

Insert-molding of precision stamped copper alloy grids within robust polymers
Sealed integration of connector pins and Hall sensors utilizing ReHot bonding
High dimensional stability of technical polymers across wide operating regimes
Resistance to automotive fluids, industrial oils, and cyclic thermal gradients

Possehl high-speed precision stamping and formed terminals

Possehl Electronics stamping facilities deliver precision terminals, connector contacts, and shielding components with sub-micron accuracy. Automated press lines incorporate multi-station progression dies and continuous inline optical inspection systems.

Progressive stamping dies engineered for intricate multi-axis terminal bending
High dimensional repeatability across multi-million volume manufacturing runs
Continuous inline optical inspection verifying critical geometric dimensions
Minimal blanking burrs and controlled bend radii for reliable pin insertion

Possehl reel-to-reel continuous electroplating technology

Possehl Electronics reel-to-reel plating lines apply functional coatings of gold, silver, nickel, and tin onto continuous metal strips. Highly selective precious metal deposition ensures optimum electrical conductivity, wear resistance, and oxidation protection.

Selective micro-deposition of gold and silver in critical terminal contact zones
Dense nickel barrier underplates preventing copper diffusion into outer coatings
Superior plating adhesion preventing peeling during secondary bending procedures
Excellent solderability and low contact resistance preserved over long shelf life

Possehl automotive electromechanical assemblies and connectors

Possehl Electronics sub-assemblies combine stamped busbars, precision connectors, and sensors for electric power steering, braking systems, and transmission control units. Products are engineered for rigorous thermal and vibration conditions within engine bays.

Stamped busbars and distribution plates for electric power steering modules
Sealed integration of position sensors and thermal monitors within housings
Laser and resistance micro-welding of internal circuit nodes under supervision
High durability under electrical surge transients and heavy chassis vibration

High-precision copper lead frames for semiconductor packaging

Possehl Electronics leads the development and volume manufacture of copper alloy lead frames for semiconductor assembly.

Serving as an essential interconnection foundation for semiconductor dies, power transistors, and integrated circuits, these components deliver exceptional thermal conductivity and mechanical alignment.

Manufacturing facilities utilize high-speed mechanical blanking and chemical etching to achieve fine pitch dimensions with minimal residual stress. Strip surfaces undergo selective electroplating with silver and gold to promote molding compound adhesion and reliable thermosonic wire bonding.

Solderless pretPin elastic press-fit contact systems

Patented pretPin press-fit contacts from Possehl Electronics provide an advanced, high-reliability alternative to conventional solder joints on printed circuit boards.

The design utilizes controlled plastic and elastic radial deformation of a flexible pin zone during mechanical insertion into metallized board holes. This creates a gas-tight, vibration-proof electrical joint featuring minimal contact resistance.

Eliminating thermal processing protects sensitive components from thermal shock and flux residues, streamlining electronics assembly.

Overmolded metal-plastic hybrid housings for automotive sensors

Possehl Electronics manufactures complex metal-plastic hybrid housings for automotive sensor modules and control systems. The manufacturing procedure combines high-precision polymer insert-molding around stamped conductive grids and terminal busbars.

To join distinct materials and internal components, patented ReHot bonding forms a hermetic seal around terminal pins. This barrier prevents engine oils, road moisture, and aggressive chemicals from reaching internal Hall sensors and capacitors under hood environments.

High-speed precision progression stamping on automated lines

Mechanical production at Possehl Electronics relies on automated high-speed stamping presses and multi-station progression tooling. The equipment performs high-velocity blanking, deep drawing, and spatial bending of copper alloy strips to micron tolerances.

Automated laser and vision systems continuously inspect edge geometry, pitch spacing, and terminal bend angles directly on running strips. Strict tool maintenance prevents blanking burrs, ensuring consistent pin insertion in robotic assembly.

Selective reel-to-reel continuous electroplating technology

Possehl Electronics operates over forty automated continuous plating lines applying functional metal finishes onto continuous strips in reel-to-reel mode. The process enables precise selective micro-deposition of gold and silver solely onto designated electrical contact areas.

A dense nickel barrier underplate prevents copper diffusion and intermetallic formation. The resulting plating exhibits superior hardness, fretting corrosion resistance, and prolonged solderability.

Electromechanical sub-assemblies for automotive chassis and steering

Possehl Electronics assembly facilities produce complete electromechanical sub-units for automotive applications, including electric power steering and electronic braking systems.

Modules integrate stamped power distribution busbars, sealed connector interfaces, Hall position sensors, and thermal monitors. Internal connections utilize automated laser and resistance micro-welding along with mechanical staking.

Operations take place in cleanroom environments with full functional electrical testing.

Possehl / Possehl Electronics and model names are trademarks of their respective owners and are used only to identify the equipment for which we source parts. SpareX is not an official dealer, distributor or representative of Possehl / Possehl Electronics and is not affiliated with the trademark owner. Origin, documents and warranty are stated for each item in the quotation.